Hottest aluminum substrate and copper clad laminat

2022-08-06
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Aluminum substrate and copper clad laminate fr

different basic structures

different main characteristics

comparison of main characteristics between aluminum substrate and FR-4 plate:

comparison of heat dissipation (expressed in saturated thermal resistance) between aluminum substrate and FR-4 plate:

substrates are PCB with transistors on aluminum substrate and FR-4 plate respectively, Every enterprise's survival is to ensure a certain profit margin. Due to the "we don't see a strange material with different heat dissipation, resulting in different test data of working temperature rise"

performance:

conductive lines (copper lines) on different substrate materials See Fig. 1 for the comparison with the fusing current. From the comparison between aluminum substrate and fr-4

plate, due to the high heat dissipation of metal substrate, the wire fusing current has been significantly improved, which indicates the high heat dissipation of aluminum substrate from another perspective

the heat dissipation of aluminum substrate is related to its insulation thickness and thermal conductivity. The thinner the insulation layer, the higher the thermal conductivity of the aluminum substrate (but the lower the voltage resistance)

machinability:

aluminum substrate has high mechanical strength and toughness, which is better than FR-4 plate. Therefore, large-area printed boards can be manufactured on aluminum substrates, and heavy components can be installed on such substrates

electromagnetic wave shielding:

in order to ensure the performance of electronic circuits, some components in electronic products need to prevent electromagnetic wave radiation and interference. The aluminum substrate can act as a shielding plate to shield electromagnetic waves

coefficient of thermal expansion:

due to the thermal expansion of general FR-4, especially in the thickness direction of the plate, the quality of metallized holes and circuits is affected. This is mainly due to the difference in the thermal expansion coefficient in the thickness direction of the raw material of the plate: the thermal expansion coefficient of copper is 17 × 106cm/cm ℃, FR-4 plate base material is 110 × 106cm/cm ℃, there is a large difference between the two, which is easy to occur: the difference in expansion change of heated substrate will cause damage to the copper line and the metallized hole, and affect the reliability of the product. The coefficient of thermal expansion of aluminum substrate is 50 × 106cm/cm ℃, smaller than ordinary FR-4 plate, closer to the thermal expansion coefficient of copper foil. This is conducive to ensuring the quality and reliability of the printed circuit board

applicable to different circuits and application fields

fr-4 board is applicable to general circuit design and general electronic products

aluminum substrate is suitable for circuits with special requirements. For example, thick film hybrid integrated circuits, heat dissipation of power supply circuits, heat dissipation and cooling of components in circuits, large-scale substrates for which ceramic substrates are incompetent, and circuits for which reliability cannot be solved by using ordinary radiators. Typical application examples:

computer power supply device, floppy disk drive, motherboard

automobile, motorcycle voltage regulator, igniter, other automatic safety control systems

power supply dc/dc, ac/dc, dc/ac, transformer

audio output amplifier, equalizing amplifier, preamplifier

electronic solid state relay, transistor base

other radiators, precision motors Instruments make new energy vehicles only serve as point-to-point transportation instruments and industrial automation equipment (end) in cities

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